Plansee TMS attending 8th China International Optoelectronic Exposition

8th China International Optoelectronic Exposition, at China Shenzhen will take place on September 6th - 9th 2007.  For more information please visit http://en.cioe.cn/index.php?option=com_content&task=blogsection&id=5&Itemid=36.  

Plansee TMS attending SPIE Photonics West 2008

SPIE Photonics West 2008, at San Jose Conventions Center, San Jose California, USA.  This event will take place from January 19th - 24th 2008.  We will be located at Booth #6354.  We will be showcasing our Opto Electronics.

Plansee TMS attending IMAPS 2007 - San Jose

International Microelectronics And Packaging Society (IMAPS) , at San Jose McEnery Convention Center, San Jose California, USA on November 11 - 15, 2007. We will be located at Booth 312 For more information please visit http://www.imaps.org/imaps2007/index.htm

Plansee TMS attending Laser 2007 World Of Photonics

World of Photonics Portal Laser 2007, at Munich International Trade Fairs on June 18 - 21, 2007.  We will be located in Hall B2 at Booth 381, and we will be showcasing silver and aluminum diamond composites.  For more information please visit http://www.world-of-photonics.net/link/en/15509426

Plansee Group strengthens its position in North America

Reutte/Carlsbad, December 1, 2006- Plansee High Performance Materials of Reutte, Austria, acquires Electro-Graph, a privately owned company headquartered In Carlsbad, California. A memorandum of understanding was signed by the two companies on November 27, 2006 and the acquisition is due to be completed in the first quarter of 2007. Electro-Graph will strengthen Plansee's position In the North American refrac­tory metal component market.

"The acquisition represents another step in our globalization strategy," comments Michael Schwarzkopf, chairman of the Plansee Group's executive board: "Electro-Graph enjoys an excellent position in the US market and has strong relationships with its customers. Moreover the company is well-known for its considerable expertise in the design, engineering and production of replacement parts and components for the semiconductor industry, specifically for use in processes such as ion implantation, sputtering and CVD coating."

"We totally agree that Electro-Graph will have great potential for development as part of the Plansee Group" says Paul Hacker, chairman of Electro-Graph. And Michael Schwarzkopf adds: "The business has performed exceptionally well under its current management and we want to continue working with this proven team in the future." The parties have agreed that the sale price will remain confiden­tial.

Privately owned US Company Electro-Graph was founded in 1979 by Paul and Jill Hacker who retired from operational business some years ago. Today Electro-Graph is run by an independent manage­ment team and employs 65 people, with projected sales for the current fiscal year of around 20 million dollars. The company's headquarters are in Carls­bad, around 30 miles north of San Diego, and it also operates a production site in Guaymas, Mexico, some 400 miles south of San Diego.

Plansee High Performance Materials, a division of the Plansee Group, is the world's leading manufac­turer of refractory metal and composite material products. The Plansee Group holds 62 companies in 22 countries worldwide. Ignoring different shares of ownership, the Group generated worldwide sales of 1.3 billion euros in the 2005/06 fiscal year, and em­ployed a total of 8,500 people.

Polese receives Supplier Excellence Award from Motorola, April 2003

In April 2003 Polese Company received an award for excellence from Motorola Inc. This award from the Semiconductor Products Sector was for its partnership in development efforts relating to Semiconductor packaging and for its high volume production of RF-LDMOS high power transistor packaging products. Polese Company continues to excel in the development of new high performance products while keeping their customers objectives and cost concerns and objectives as a number one priority.

Polese Introduces New laminate material, July 2003

Polese Company, in close coordination and cooperation with The Plansee Group based in Austria has developed the first of a new family of Laminate Thermal Materials. These materials can be utilized in applications where more complex devices are generating a greater heat implications for packages. The first of these is a 1-4-1 ratio of Copper-Moly Copper-Copper, a superior material that can be used for carriers, heatsinks, GaAs device mounts and SMP conductors.

This product, through the processes utilized by Polese, include standard and custom formulations that can be used for most applications where there is an intense need for controlled coefficient of thermal expansion and high thermal & electrical conductivity. The 1-4-1 Laminate is manufactured with a thermal conductivity range up to 300W/m K, thermal expansion at a rate of 7.0- 8.5 x 10-6 with a temperature range of 25ºC – 400ºC and a density of 9.45g/cc. These are typical characteristics of this new development that can assist with the newest electronic design requirements and capacities. Please contact sales@polese.com with your demanding thermal requirement and we will provide the solution.