As a highly capable and responsive player in this very large market, PTMS manufactures both single chip and multi chip substrates for low and medium volume applications. PTMS has the ability to put in pins, seal frames and produce packages as large as four inches square and between 2 and 30 layers of circuitry.  Today’s requirement for high reliability in the area of Fiber Optic laser and pump transceiver packages has led PTMS to develop a line of feedthroughs which can transmit a signal through a hermetic enclosure. These feedthroughs have an additional advantage over traditional glass feedthroughs in that they allow the designer to exit on one end and be transmitted out in the optimum location, not just in a straight line. Ceramic feedthroughs are also much less susceptible to breakage and leakage in handling or in assembling of conductors.