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Copper Tungsten 
• Industry
Standard for Thermal Management
• Microwave carriers and Heat sinks
• Microelectronic package bases
• GaAs device mounts
• Microprocessor lids
• Surface Mount Package Conductors
• Controlled coefficient of thermal expansion
• High thermal and electrical conductivity
• Near-net shape capability with PTMS patented powder
metallurgical process
• Standard and custom formulations for most any application
PROPERTIES DATA
| Standard Copper Content |
% wt. |
10 - 25 |
| Density |
g/cc |
15.2 - 16.9 |
| Thermal Conductivity |
W/m K |
200 - 240 |
| Thermal Expansion |
25ºC - 300ºC |
6.3 - 8.5 x 10 -6 |
| Electrical Conductivity |
%IACS |
37 - 44 |
| Young’s Modulus |
GPa |
274 - 306 |
| Thermal Capacity |
J/cc ºC |
2.58 - 3.21 |
Typical data is believed
to be accurate and reliable, but is presented without guarantee
or warranty.
Experienced materials and microelectronics
packaging professionals are available to support your material selection
and design efforts. Contact your local representative or our factory
today.
Copper
Molybdenum
•
Lightweight thermal management
requirements
• Microwave carriers and Heat sinks
• Microelectronic package bases
• Controlled coefficient of thermal expansion
• Good thermal and electrical properties
•
Near-net shape capability with PTMS patented powder
metallurgical process
PROPERTIES
DATA
| Standard Copper Content |
wt. % |
15 |
| Density |
g/cc |
10.0 |
| Thermal Conductivity |
W/m K |
170 - 210 |
| Thermal Expansion |
25ºC - 300ºC |
7.0 x 10-6 |
| Electrical Conductivity |
%IACS |
34 - 36 |
| Young’s Modulus |
GPa |
274 |
| Thermal Capacity |
J/cc ºC |
2.76 |
Typical data is believed to
be accurate and reliable, but is presented without guarantee or
warranty.
Experienced materials and microelectronics packaging professionals
are available to support your material selection and design efforts.
Contact your local representative or our factory today.
Copper-MolyCopper-Copper
Laminate
• Industry Standard for Thermal Management
•
Microwave carriers and Heat sinks
• Microelectronic package bases
• GaAs device mounts
• Surface mount package conductors
• Controlled co-efficient of thermal expansion.
• High thermal and electrical conductivity.
• Net shape capability with PTMS patented powder
metallurgical process.
• Standard and custom formulations for most any application.
PROPERTIES DATA
| Standard Composition |
Cu-MoCu-Cu |
1-4-1 |
|
Density |
g/cc |
9.45 |
| Thermal Conductivity
|
W/m K |
300 |
| Thermal Expansion
|
25ºC – 400ºC |
7.0- 8.5 x 10 -6 |
Typical data is believed
to be accurate and reliable, but is presented without guarantee
or warranty.
Experienced materials and microelectronics
packaging professionals are available to support your material selection
and design efforts. Contact your local representative or our factory
today.
Silver Diamond
• Excellent Thermal
Conductivity
• Low Thermal Expansion
• Microwave carriers and Heat sinks
• Well adapted to
semi-conductors and ceramics
• High Performance micro and
optoelectronics
• Predestined for Thermal Management
Applications
• Heat Spreaders
Copper Diamond
• Excellent Thermal
Conductivity
•
High Volume Fraction Diamond
• Heat Spreaders
•
Heat sinks in Microelectronic packages
•
Tailorable coefficient of Thermal Expansion
PROPERTIES
DATA
| Specific Heat |
J/gK |
0.44 |
| Density |
g/cc |
5.5±0.04 |
| Thermal Conductivity |
W/m K |
470/465 |
| Thermal Expansion |
25ºC - 300ºC |
6.7/7.7 |
| Electrical Resistivity |
µΩcm |
9±0.8 |
| Young’s Modulus |
GPa |
255±10 |
| Thermal Capacity |
J/cc ºC |
230±10 |
Typical data is believed to
be accurate and reliable, but is presented without guarantee or
warranty.
Experienced materials and microelectronics packaging professionals
are available to support your material selection and design efforts.
Contact your local representative or our factory today. |
