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As the world leader
in controlled expansion, high conductivity, thermal management
substrates, such as Tungsten Copper, Moly Copper, AlSiC and the new
Copper /MolyCopper/ Copper laminate materials, PTMS has a long
history of supplying carriers, base plates and other substrates used
to match the coefficient of expansion of Silicon, Alumina, and
Beryllium Oxide. In addition PTMS materials are also used in
conjunction with glass feed through materials such as Kovar, Alloy
46 and others.
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